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Chat OnlineIf your processor is a flip chip design and the issue could be the solder bumps between the IC and the substrate. A reflow might fix it for a while but even reflows are very limited. YLOD (as well as RROD on a Xbox) are caused by the design of the processor not necessarily by bad or cracked solder joints.
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Chat OnlineOct 15 2017 · Check out this iPhone CPU repair or this repair on a laser-decapped chip. via r/electronics Posted in Repair Hacks Tagged chip die ic QFP repair soldering
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Chat OnlineJan 20 2019 · The phone is an iPhone 7 which a service center reported had issues with the CPU and the only fix was a full mainboard replacement. The Kardi Lab
Chat OnlineEvan Selleck writing for iPhoneHacks (edited and condensed) For many iPhone 6 and iPhone 6 Plus owners out there in the wild a design defect is apparently causing some huge issues.Gadget repair firm iFixit has reported about a flaw dubbed "Touch Disease" which it claims is cropping up.
Chat OnlineMost of the times BGA Chip got faulty and need to be replaced with the new one. Sometimes PCB motherboard needs a BGA Chip Upgradation. When a chip start to heat it makes the solder ball hot and become loose and change it s location because of that sometimes it creates a Solder Bridge which can also make your PC dead.
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Chat OnlineMost of the times BGA Chip got faulty and need to be replaced with the new one. Sometimes PCB motherboard needs a BGA Chip Upgradation. When a chip start to heat it makes the solder ball hot and become loose and change it s location because of that sometimes it creates a Solder Bridge which can also make your PC dead.
Chat OnlineThis S001 Automatic Chipset Grinding Milling Engraving Router Machine is perfect to grind and remove the CUP HHD WIFI FONT chips in iPhone series mobile phone without any damage in the board. It is effective machine to help you repair the iPhone 4 4S 5 5C and 5S. How to use this IC chipset grinder machine Step 1.
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Chat OnlineOct 15 2017 · Check out this iPhone CPU repair or this repair on a laser-decapped chip. via r/electronics Posted in Repair Hacks Tagged chip die ic QFP repair soldering
Chat OnlineRemove 6s power IC with hot air gun can be a real risk that s why we recommend CNC chip grinding machine here. Grinding. Put the iPhone 6s logic board on the corresponding iPhone 6s mold and set grinding program. Click and clear numerical value of x-axis and y-axis. Move the milling cutter of the grinding machine to the corresponding power
Chat OnlineScreen repair. You can repair a cracked iPhone screen at an Apple Store an Apple Authorized Service Provider or by sending it to an Apple Repair Center. If you have an AppleCare plan you can use it to cover screen repair. All of these locations use genuine Apple parts to ensure that your screen works like new after it s repaired.
Chat OnlineTake a look at the technology of mobile touch screen displays -- resistive vs. capacitive single-touch vs. multitouch and how companies are working to reduce weight while improving quality.
Chat OnlineMay 29 2014 · Step 6position the BGA chip on the pads (in our designs we place 4 small pads in the BGA corners so when you place the IC the corner of the ICs lay on these registration pads) Step 7heat the BGA with the hot air to 250 C and keep it hot above 250 C for about 30 seconds.
Chat Online• Charging IC Located near resister 22 the charging IC regulates battery recharging. • Audio IC. Located next to the Power IC this is the mobile devices sound chip. • Real Time Clock (RTC) Located next to the Power IC this silicon oscillator is the clock of the PCB. • Logic IC. The logic IC operates the ringer vibrator and LEDs.
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Chat OnlineCapacitor replacement is one of the easier repairs to make. 3 on ebay would get you a replacement cap of the right size and you could solder it back in with a cheap iron. I ll also throw in if you want to do localized reflow without heating the whole board a heatshrink gun can work (Sparkfun has a Heaterizer 2000 for like 10).
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Chat OnlineMost of the times BGA Chip got faulty and need to be replaced with the new one. Sometimes PCB motherboard needs a BGA Chip Upgradation. When a chip start to heat it makes the solder ball hot and become loose and change it s location because of that sometimes it creates a Solder Bridge which can also make your PC dead.
Chat OnlineIf your processor is a flip chip design and the issue could be the solder bumps between the IC and the substrate. A reflow might fix it for a while but even reflows are very limited. YLOD (as well as RROD on a Xbox) are caused by the design of the processor not necessarily by bad or cracked solder joints.
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